Amkor Technology, Inc. Share Price & Technical Analysis

AMKR · $73.57 (+11.89%)

Technology / Semiconductor Equipment & Materials

AI Score 53 · Weak

$73.57

+11.89%

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, burn-in, system-level and final test, and drop shipment services; flip chip scale package products for smartphones,

Price chart

Seasonality

May has 4 positive and 1 negative years (last 5 years shown)

-5% return in May, 5% avg return in past 3 year May month.

63% return in 2026, 29% avg return in past 3 years.

Swipe sideways to see all months →

JanFebMarAprMayJunJulAugSepOctNovDecYr
2618%1%-3%52%-5%63%
25-6%-12%-15%-3%2%17%9%10%21%15%7%10%55%
24-3%-3%3%0%2%21%-19%3%-5%-16%3%-3%-17%
2319%-12%1%-13%11%20%-3%-2%-20%-7%36%19%49%
22-12%2%-4%-14%8%-17%22%1%-13%21%30%-15%7%

Monthly return % by calendar month · historical pattern, not a forecast

AI snapshotScore 53/100

Weak · Strong · Uptrend

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, burn-in, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.

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Key metrics

Market cap

$17.57B

P/E ratio

40.74

52W high

$79.23

52W low

$17.79

Volume

68,64,134

Beta

2.31

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