Kulicke and Soffa Industries, Inc. Share Price & Technical Analysis
KLIC · $107.5 (+2.98%)
Technology / Semiconductor Equipment & Materials
$107.5
+2.98%
Kulicke and Soffa Industries, Inc. designs, manufactures, and sells capital equipment and consumables in China, the United States, Taiwan, Malaysia, Japan, the Philippines, Korea, Hong Kong, and internationally. It operates through four segments: Ball Bonding Equipment, Wedge Bonding Equipment, Advanced Solutions, and Aftermarket Products and Services (APS). The company provides services used to a…
Price chart
Seasonality
May has 4 positive and 1 negative years (last 5 years shown)
22% return in May, 3% avg return in past 3 year May month.
93% return in 2026, 10% avg return in past 3 years.
Swipe sideways to see all months →
| Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec | Yr | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 26 | 22% | 23% | -4% | 29% | 22% | – | – | – | – | – | – | – | 93% |
| 25 | -6% | -12% | -14% | -1% | -2% | 8% | -5% | 16% | 11% | -1% | 13% | 2% | 10% |
| 24 | -7% | -4% | 5% | -8% | 0% | 6% | -4% | -6% | 5% | 0% | 7% | -4% | -9% |
| 23 | 13% | 4% | -1% | -8% | 11% | 12% | 1% | -13% | -6% | -15% | 24% | 6% | 28% |
| 22 | -10% | -5% | 7% | -18% | 18% | -21% | 15% | -12% | -6% | 7% | 13% | -8% | -21% |
Monthly return % by calendar month · historical pattern, not a forecast
Neutral · Strong · Strong
Kulicke and Soffa Industries, Inc. designs, manufactures, and sells capital equipment and consumables in China, the United States, Taiwan, Malaysia, Japan, the Philippines, Korea, Hong Kong, and internationally. It operates through four segments: Ball Bonding Equipment, Wedge Bonding Equipment, Advanced Solutions, and Aftermarket Products and Services (APS). The company provides services used to assemble semiconductor devices, such as integrated circuits, power discretes, light-emitting diode (LEDs), and sensors. It also offers ball bonding equipment, wafer level bonding equipment, and wedge and wedge-related bonding equipment; and advanced display, die-attach, and thermocompression systems and solutions, as well as tools, spares, and services for equipment. In addition, the company services, maintains, repairs, and upgrades equipment; and sells consumable aftermarket solutions and services. It serves integrated device manufacturers, outsourced semiconductor assembly and test providers, other electronics manufacturers, foundry service providers, and automotive electronics suppliers primarily in the United States and the Asia/Pacific region. The company was founded in 1951 and is headquartered in Singapore.
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Key metrics
Market cap
$5.10B
P/E ratio
94.69
52W high
$108.6
52W low
$31.32
Volume
4,64,721
Beta
1.67
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